Published by admin on 19 Jun 2008
EPS to EPS Foam Bonding with Hotmelt
Further information:
Beads of GIA1051 hot melt applied to different density EPS Foams.
Beads of GIA1051 at 334 F burn very little into substrate.
GIA1051 has a long open time that also gives good initial tack.
Bond between substrates is repositionable.
Bonds between EPS foams are permanent and destructible bonds.