Published by admin on 17 Feb 2009

T Nozzles for Packaging and Case Sealing

Erecting and sealing cases, cartons and boxes with hot melt adhesive is standard practice in the packaging industry. This is usually accomplished by spreading hot melt over case flaps in a series of parallel beads. Using smaller parallel beads on close centers bonds much faster than using a large bead or two. These smaller beads also offer a much stronger lamination bond, rather than the less effective point of contact bond.

T Nozzle on High Flow Manual Bead Hotmelt Handgun

T Nozzle on High Flow Manual Bead Hotmelt Handgun

“T” nozzles, or spreader nozzles, have been used as a low cost method of channeling hot melt into multiple patterns from one applicator. Hot melt adhesive flows under pressure into this “T” or spreader nozzle and is channeled into a series openings on close centers. The “T” nozzle or spreader nozzle is used with hot melt stick guns, hot melt bulk guns as well as automatic hot melt guns.

T Nozzle on ChampStick400 available from Glue Machinery Corporation

T Nozzle on ChampStick400 available from Glue Machinery Corporation

The “T” nozzle is not suitable for precise application requirements, as there can be a tendency for temperature variations within the nozzle. The “T” nozzle is much larger than a standard nozzle, so the adhesive temperature varies as it moves through the nozzle and further from the heat source. This can create poor patterning and hot melt stringing. The use of low viscosity
hot melt will result in better flow from the “T” nozzle.

Frequent and consistent use of the gun and nozzle, will also improve patterning, as the hot melt flow through the nozzle actually heats the nozzle making for more consistent temperatures from gun to substrate.

T Nozzles on Glue Machinery Corporation Adhesive Guns
T Nozzles
on Glue Machinery Corporation Adhesive Guns

Contact Pierce Covert at 410.761.2727 to discuss this simple alternative to improving your case sealing operation. Also see: Ergo Erector Basic Case Sealer

Published by admin on 19 Jun 2008

EPS to EPS Foam Bonding with Hotmelt

Further information:

Champ 5 with GIA1051 Hot Melt

Beads of GIA1051 hot melt applied to different density EPS Foams.

Beads of GIA1051 at 334 F burn very little into substrate.

GIA1051 has a long open time that also gives good initial tack.

Bond between substrates is repositionable.

Bonds between EPS foams are permanent and destructible bonds.